Low Pressure Injection Molding (LPIM)
LPIM is particularly suitable for components that require effective protection against external influences or where component housings can be completely eliminated.
Low-pressure injection molding (LPIM), which specializes in this area, offers numerous advantages:
- The encapsulating material (hot melt) is processed in a hot, liquid state with very low viscosity and requires only very low injection pressures. This is particularly important for components that are highly sensitive to pressure, impact, and moisture (e.g., electronic components (circuit boards, LED electronics), sensors, microswitches, etc.).
- Relatively simple, cost-effective, and maintenance-friendly mold technology with optimized molding (flexible, miniaturized product design with a wide range of surface and shape properties).
- Over molded components and parts
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- are waterproof,
- offer vibration protection and strain relief,
- have very good chemical resistance,
- offer high environmental compatibility (hot melted material made from renewable raw materials, 100% recyclable).
- Very short cycle times: the conventional 7-step potting process is reduced to a 3-step injection molding process – reducing cycle times to < 60 seconds.
- Multi-cavity molds enable optimized productivity and cost efficiency.
- Applicability for applications in a wide range of industries, such as: E.g., electrical engineering/electronics, automotive, trucks, buses, rail, agricultural/construction machinery, household appliances, medical, environmental technology, laboratory/measurement technology.
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